TOP STORIES
Stanford, Korean nanofab center,
Oregon-based semi startup claim 3D IC
breakthrough
 To
allow low-cost memories and
high-performance logic products with
large embedded memory blocks, Stanford
University's Nanofabrication Facility
along with Daejeon, Korea-based National
NanoFab Center and Beaverton, Ore-based
BeSang Inc are reporting what they say
is a 3D IC technology breakthrough. Read
more >>
FPGAs aren't gone yet—or even slowing
down. But...
 If
the back-end flow in FPGA designs is
becoming as complex and difficult as the
back-end design for a cell-based ASIC,
then the major savings in NRE have to
come from other areas. EDN's
Ron Wilson presents an interesting
economic implication concerning the
future of FPGAs in this Practical Chip
Design blog post, where he also welcomes
your thoughts on the semiconductor
market segment. Read
more >> |
MORE NEWS AND COMMENTARY
Windows-on-OS X virtualization: Hands-On
VMware analysis
AMD manufacturing VP leaves for Osram
Applied reports Q3 sales drop, reflects
difficult semi industry environment
Nvidia quarter down on desktop market,
price pressure, product issues
Materials bend visible and infra-red
light backwards
FEI, Icon to develop imaging facility in
India
MORE ARTICLES >> |
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FEATURED TALES FROM THE CUBE
Ghost busting on the ocean floor
 Spurious
images in a side-scan sonar system lead to a
further mystery for Hugh Shane, lead
communications engineer at Mitre Corp. Hugh
asks why it took so long for someone to try
putting the unit into self-test mode in this
Tales From The Cube entry. Read
more >>
In EDN's Tales From The Cube, engineers
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FEATURED CONTENT
Baker's Best
Texas Instruments' Bonnie Baker
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analog design, both for the
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unfamiliar territory, in EDN's
Baker's Best column. Click here
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